Item# 1031241

KOC Heat Sink Compound 24X20G

Compound for thermal coupling and heat

Product Description

Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components.

Features

• High thermal conductivity.

• Excellent moisture buffer.

• Low metallic impurity content.

Productidentification
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EAN / GTIN5412386071409
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Label directionsApply the paste on the clean and dry surface between the heat generating component and the cooling surface.
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Security information

  • H410

  • P102
  • P273
  • P391
  • P501-2

Resources