Item#
KOC Heat Sink Compound 12X100G
Compound for thermal coupling and heat dissipation
Product Description
Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components. Features • High thermal conductivity. • Excellent moisture buffer. • Low metallic impurity content.
| Productidentification | |
|---|---|
| EAN / GTIN | 5412386064708 |
| Label directions | Apply the paste on the clean and dry surface between the heat generating component and the cooling surface. |
Security information
- H410
- P102
- P273
- P391
- P501-2

