Item#
KOC Heat Sink Compound 24X20G
Compound for thermal coupling and heat
Product Description
Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components.
Features
• High thermal conductivity.
• Excellent moisture buffer.
• Low metallic impurity content.
| Productidentification | |
|---|---|
| EAN / GTIN | 5412386071409 |
| Label directions | Apply the paste on the clean and dry surface between the heat generating component and the cooling surface. |
Security information
- H410
- P102
- P273
- P391
- P501-2

